ResinLab EP965 Epoxy Encapsulant Part B Black 1 qt Can
Part #: EP965 BLACK - B QT
Manufacturer SKU: EP965 BLACK B QT
ResinLab EP965 Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part B, 1 qt Can.