Part number: 90-001896Manufacturer SKU: 2013348
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DescriptionHenkel Loctite OXY-BOND 109-DP Epoxy Clear is a two component, room temperature curing, resin that is used for laminating, small potting, and industrial applications. It bonds well to plastics, metal, optical fibers, and ceramics. It offers low viscosity, low shrinkage, wide service temperature range, and durability. It has excellent physical, mechanical, and electrical properties. It is resistant to water, gasoline, oxygen, alcohol, weather, salt solutions, inorganic and organic compounds. 50 mL Cartridge.
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Product Details
Typical Use: Recommended for electronic/electrical casting and encapsulating applications. Excellent in high voltage applications, such as power supplies, transformers, bushings and insulators. Brand: OXY-BOND Chemical Composition: Resin: Epoxy; Hardener: Polyglycol Color: Clear Components: 2 part Cure System: Room Temperature/Heat Cure Time: 24h @ 25 °C; 0.5h @ 65 °C Dielectric Strength: >400 V/mil Flash Point: Resin: 248.8 °C; Hardener: 139 °C Hardness: 83 D Mix Ratio: 100:50 by volume; 100:45 by weight Service Temperature: -60 to 120 °C Shear Strength: 2,500 @ 25 °C; 500 @ 100 °C Specific Gravity: Mixed: 1.15 Tensile Strength: 7,300 psi Viscosity: Mixed: 2,500 @ 25 °C Working Time: 0.5h -
SDS / TDS
