Part number: 55 WHT 2LB RESIN ONLY Manufacturer SKU: 1188210
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DescriptionHenkel Loctite Ablestik 55, formerly Emerson and Cuming ECCOBOND, is a two component, unfilled, epoxy adhesive resin that is used for electronic assemblies, anchoring inserts, hermetic sealing, and bonding of plastics, metal, ceramics, and glass. It offers low viscosity, good wetting, and resistance to water, chemicals, and solvents. 1 qt Can.
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Product Details
Typical Use: Used for electronic component assembly, staking of adjustment and calibration screws and anchoring inserts, end fills or hermetic sealing. Brand: Ablestik Chemical Composition: Epoxy Color: Milky White Components: 2 part Cure System: Room Temperature/Heat Cure Time: Catalyst 9: 16 to 24h @ 25 °C; Catalyst 11: 8 to 16h @ 80 °C; Catalyst 23LV: 24h @ 25 °C Dielectric Strength: Catalyst 9: 17 kV/mm Flash Point: 254 °C Mix Ratio: Catalyst 9: 100:15.5 by volume, 100:13.5 by weight; Catalyst 11: 100:17 by volume, 100:16 by weight; Catalyst 23LV: 100:32 by volume, 100:28 by weight Service Temperature: Catalyst 9: -40 to 130 °C; Catalyst 11: -55 to 155 °C; Catalyst 23LV: -65 to 105 °C Shear Strength: Catalyst 9: 1,700 @ 25 °C Specific Gravity: 1.18 Viscosity: Catalyst 9: 8,000; Catalyst 11: 7,100; Catalyst 23LV: 3,300 Volume Resistivity: Catalyst 9: >1 x 10^15 ohm-cm @ 25 °C Working Time: Catalyst 9: 45min @ 25 °C; Catalyst 11: >4h @ 25 °C ; Catalyst 23LV: 60min @ 25 °C -
SDS / TDS
