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DescriptionDow 7920 Die Attach Adhesive Black is a one component, heat curing, microelectronics adhesive that provides high temperature stability, stress relief, seals packaging, and bonds with a variety of substrates. It offers unprimed adhesion, high strength, flowability, low modulus, and low levels of ionic impurities. 30 g Tube.
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Product Details
Typical Use: Used for microelectronic devices that require low modulus materials, lead-free solder reflow temperatures, or other high-reliability applications. Color: Black Components: 1 part Cure System: Heat Cure Time: 30min @ 125 °C; 60min @ 150 °C Flash Point: >182.2 °C Hardness: 71 A Shear Strength: 1,000 Specific Gravity: 1.2 @ 25 °C Viscosity: 18,000 Working Time: >24h @ 25 °C -
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