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DescriptionResinLab EP965 Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part A, 1 qt Can.
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Product Details
Typical Use: Designed for medium sized castings. Chemical Composition: Epoxy Color: Black Components: 2 part Cure System: Room Temperature/Heat Cure Time: 24h @ 25 °C; 1h @ 65 °C; 20min @ 100 °C; 15min @ 110 °C Dielectric Strength: 410 V/mil Elongation: 5% Flash Point: 249 °C Hardness: 80 D Mix Ratio: 1:1 by volume; 1.17:1 by weight Service Temperature: -40 to 150 °C Shear Strength: 1,200 Specific Gravity: Part A: 1.16; Part B: 0.97; Mixed: 1.07 Tensile Strength: 8,500 psi Thermal Conductivity: 0.1 W/mK Viscosity: Part A: 16,000; Part B: 9,000; Mixed: 14,000 Volume Resistivity: 8 x 10^14 ohm-cm Working Time: 15 to 20min -
SDS / TDS