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DescriptionDow EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C, low viscosity, and no mixing needed. 190 kg Drum.
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Product Details
Typical Use: Used for protecting and potting of electronics, and power semiconductor modules to protect interconnects and dies from outside conditions. Color: Clear Components: 1 part Cure System: Heat Cure Time: 15min @ 125 °C; 10min @ 150 °C Dielectric Strength: 533 V/mil Flash Point: >100 °C Specific Gravity: 0.97 Viscosity: 690 Volume Resistivity: 2e + 15 ohm-cm -
SDS / TDS