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DescriptionDow DOWSIL™ EG-3896 Dielectric Gel is a two component, somewhat hazy to clear, fast heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers flowability, resistance to crack formation, and cures to a soft material. 1:1 mix ratio. 36 kg Kit.
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Product Details
Typical Use: Used for protecting and potting of electronics, and power semiconductor modules to protect interconnects and dies from outside conditions. Brand: DOWSIL Color: Hazy to Clear Components: 2 part Cure System: Heat Cure Time: 30min @ 70 °C; 10min @ 100 °C; 5min @ 150 °C Dielectric Strength: 559 V/mil Flash Point: >100 °C Mix Ratio: 1:1 Specific Gravity: Part A: 0.98; Part B: 0.97 Viscosity: Mixed: 520 Volume Resistivity: 2e + 15 ohm-cm Working Time: >4h @ 25 °C -
SDS / TDS