Part number: EP1325 BLACK GLManufacturer SKU:
For current pricing and to place an order please contact your Ellsworth Customer Service Representative.
Call Us Contact Customer Service at +65 9386 6411。
Live Chat Speak with one of our Technical Service Personnel.
Request a Quote Submit a quote request and a Sales Representative will contact you.
Send an Email We will respond within 1 business day.
-
DescriptionResinLab EP1325 Black is a one component, heat curing, thixotropic epoxy that is used for potting, damming, staking, and bonding circuit board components, metals, and plastics. It offers low shrinkage, good dielectric properties and environmental protection. 1 gal Pail.
-
Product Details
Typical Use: Used as a small mass potting compounds, staking or damming adhesives, or polymer systems where the application requires low shrinkage and excellent adhesion to a wide variety of plastics, metals and circuit board materials. Chemical Composition: Epoxy resin Color: Black Components: 1 part Cure System: Heat Cure Time: 5 to 10min @ 150 °C Dielectric Strength: 440 V/mil Elongation: Flash Point: >93.3 °C Hardness: 85 D Service Temperature: -40 to 150 °C Shear Strength: 1,500 Specific Gravity: 1.3 Tensile Strength: 4,800 psi Thermal Conductivity: 0.36 W/mK Viscosity: 500,000 Volume Resistivity: 8 x 10^14 ohm-cm -
SDS / TDS
