Part number: EP1115 CLEAR A PLManufacturer SKU:
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DescriptionResinLab EP1115 Clear is a two component, room and elevated temperature curing, unfilled epoxy adhesive that is used for bonding plastics, metal, and ceramics. It provides good resistance to temperature, salt solutions, water, organic and inorganic solvents. Part A, 5 gal Pail.
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Product Details
Typical Use: Bonding of metals, ceramics and most plastics. Chemical Composition: Epoxy Color: Clear Components: 2 part Cure System: Room Temperature Cure Time: 24h @ room temperature Dielectric Strength: 440 V/mil Elongation: 10% to 25% Flash Point: 252 °C Hardness: 80 D Mix Ratio: 1:1 Service Temperature: -40 to 130 °C Specific Gravity: Part A: 1.16; Mixed: 1.1 Thermal Conductivity: 0.183 W/mK Viscosity: Part A: 16,000; Mixed: 30,000 Volume Resistivity: 8 x 10^12 ohm-cm Working Time: 8 to 12min -
SDS / TDS
