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DescriptionResinLab EP965LVLX Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for small to medium casting, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. 50 mL Cartridge.
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Product Details
Typical Use: Designed for small to medium sized castings. Chemical Composition: Epoxy Color: Black Components: 2 part Cure System: Room Temperature/Heat Cure Time: 24h @ room temperature; 1h @ 65 °C; 20min @ 110 °C Dielectric Strength: 410 V/mil Elongation: 10% @ break Flash Point: >93 °C Hardness: 80 D Mix Ratio: 0.96:1 by volume; 1.13:1 by weight Service Temperature: -40 to 121 °C Shear Strength: 1,900 Specific Gravity: Mixed: 1.08 Tensile Strength: 4,000 psi Thermal Conductivity: 0.13 W/mK Viscosity: Mixed: 2,800 Volume Resistivity: 2.40 x 10^14 ohm-cm -
SDS / TDS