ResinLab EP1330 Epoxy Adhesive Black 0.75 gal Pail
Part #: EP1330 GL
Manufacturer SKU:
ResinLab EP1330 Black is a one component, heat curing, epoxy polymer system that is used for staking, damming, potting, and bonding circuit board components, metals, and plastics. It offers high thermal conductivity, semi-free flowing, low shrinkage, and self leveling properties. 0.75 gal Pail.